Established in 2013, Tianjin Huahai Qingke Electromechanical Technology Co., Ltd. is a national strategy for Tianjin Municipal Government and Tsinghua University to implement the “Beijing-Tianjin-Hebei integration” and to promote the industrialization of chemical mechanical polishing (CMP) technology and equipment in China. enterprise.
Huahai Qingke is mainly engaged in the R&D, production, sales and service of CMP equipment and technology and supporting consumables. The core team members are from the State Key Laboratory of Tribology of Tsinghua University and professionals in the industry. They have more than 200 patents on CMP technology, and the products can be widely used. In the field of very large scale integrated circuit manufacturing, packaging, MEMS manufacturing, wafer flattening, substrate manufacturing and so on.
Huahai Qingke relies on international business philosophy, talent team and advanced process test conditions to provide advanced CMP equipment and process integration solutions for enterprises, universities and research institutes in related fields, and to follow the "Technology Service Society". The company's mission is to continue to win the trust of domestic and foreign users with excellent quality and excellent service.
Product development and history
On April 10, 2013, Huahai Qingke was established.
In August 2015, Huahai Qingke's first 12-inch CMP equipment Universal-300 entered the customer's large production line; Universal-300 is China's first 12" CMP equipment to enter the large production line. This model has high technical content and stable performance. Integrated circuit manufacturing, wafer substrate production, CMP abrasive material development and related scientific research.
In November 2015, Huahai Qingke applied for the National Science and Technology Major Special Project 02 “28-14nm Polishing Equipment and Process, Supporting Materials Industrialization” project was approved. In December 2015, the Universal-300 upgraded Universal-300 Plus was successfully developed. The Universal-300 Plus is a new 12-inch CMP device with complete independent intellectual property rights according to market demand. It adopts the mature technology of the Universal-300 model. It integrates various end-point detection technologies and has the advantages of high technical level, high output, stable performance, flexible combination of multiple units and multiple processes, which can greatly meet the process requirements of different customers and has strong market competitiveness.
In December 2015, the company was approved by the Tianjin Science and Technology Association to form an “Academician Expert Workstation”.
In December 2015, Huahai Qingke was approved as a “high-tech enterprise”
In December 2017, Huahai Qingke CMP equipment broke through 100,000 wafers on the client's large production line.
In 2018, Huahai Qingke Cu & Si CMP equipment, W CMP process equipment, Si CMP process equipment, TSV packaging process, SiO2 CMP process equipment entered the client.
Beijing Internation Seminar on Micro-Electronics & IC WORLD Conference
京ICP备19033821号 Copyright 2019 © 2019 IC World congress and Exposition