Agenda

November 28 - 30, 2019 Beijing International Exhibition Center

Agenda
Agenda2019.11.28—11.30
Summit2019.11.28
Thematic Forum2019.11.29
Date Time Content Place
November 28, 2019 08:55-09:25 Opening Ceremony Performance Yichuang International Exhibition Center
November 28, 2019 09:25-17:00 Summit Forum Yichuang International Exhibition Center
November 28, 2019 18:00-20:30 Welcome dinner Beijing Chaolin Songyuan Hotel
November 29, 2019 08:30-17:40 Thematic Forum Yichuang International Exhibition Center
November 30, 2019 09:00-12:00 Exposition Yichuang International Exhibition Center
Chaired by: Chen Xiaonan, Deputy Director of Management Committee of Beijing Economic-Technological Development Area
                     Ju Long, Global Vice President and President of China Region from SEMI;
                     Xue Song, President of CASPA
Time Content
09:25-09:45 Speech by guests
Ding Wenwu, President of China Integrated Circuit Industry Investment Fund
09:45-10:05 Speech by guests
Ye Tianchun, Director of Institute of Microelectronics of the Chinese Academy of Sciences, Leader of national 02 special expert team
10:05-10:30 To face the challenge and create the future jointly
Zhao Haijun, Joint CEO of Semiconductor Manufacturing International Corporation
10:30-10:55 Innovation, the foundation of breakthrough of domestic EDA
Liu Weiping, Chairman of the Board of Huada Empyrean Software Co., Ltd.
10:55-11:20 Embracing the era of science and technology with correct attitude
Huo Da, Chairman of the Board of China Merchants Securities
11:20-11:45 New international situation, new challenges and new opportunities for industry
Ju Long, Global Vice President and President of China Region from SEMI
11:45-12:10 Gate-All-Around FET to Enable Logic 3nm and Beyond
Pan Yang, Vice President and Chief Technology Officer of Global Product Business Division of Lam Research Corporation
12:10-13:30 Luncheon & buffet lunch
13:30-13:55 Create chip ecology, promote new breakthrough
Zhao Dongyan, Chairman of the Board of Smart Chip Microelectronics
13:55-14:20 Innovating through customer orientation, to bring infinite possibilities to the industry
Zhao Jinrong, President and Chief Executive Officer of NAURA Technology Group Co., Ltd.
14:20-14:45 Fundamental Shifts in the Electronic Ecosystem
Ling Lin, Global Vice President and General Manager of China Region of Mentor, A Siemens Business
14:45-15:10 The global development trend of 5G RF front end and the countermeasures and solutions of Chinese companies
Qian Yongxue, Chairman of the Board and General Manager of OnMicro
15:10-15:35 Focus on strategic opportunities and enhance core competitiveness
Yao Lijun, Chairman of the Board of Konfoong Materials International Co., Ltd
15:35-16:00 Market Trend and Technology Innovation toward the Autonomous Driving Era
Tomomitsu Maoka, Senior Vice President and Chairman of the Board in China region of Renesas Electronics
16:00-16:25 Smart Applications and the Trend of Packaging Solutions
Guo Yifan, Vice President of ASE
16:25-16:50 Semiconductor intelligent manufacturing in innovation
Toshihiko Nishigaki, VP & General Manager of Tokyo Electron Ltd., Corporation Innovation Division
  • Time: November 29 (Friday) 9:00-12:20
    Place: Hall B on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: CASPA and CBSIA
    Chaired by: JIN WANG, Minister of Ministry of Foreign Affairs, CASPA
    Time Speech Title
    09:00-9:10 Speech by guests
    Xue Song, President of CASPA
    09:10-09:35 Millimeter wave integrated circuit and its intelligent application
    Xu Hongtao, Co-founder of ICLegend and Researcher of School of Microelectronics, Fudan University
    09:35-10:00 Localized equipment platform for chip packaging test
    Zhou Maolin, Chief Executive Officer of Smartgiant
    10:00-10:25 The challenges and opportunities brought by cloud computing for automobile electronic EDA
    Shi Songhua, Director of CASPA in Shanghai
    10:25-10:50 Autopilot and related chip design
    Xia Haitao, Director of CASPA
    10:50-11:15 Automotive Semiconductor Innovation in AI Era
    Lyu Hao, Chief Technology Officer of automotive electronics business of NXP in Greater China
    11:15-11:40 3D depth sensor -- the cornerstone of automatic driving
    Xue Song, President of CASPA
    11:40-12:20 Round-table conference
    Theme: Innovation trend and future prospects of automotive semiconductor
    Chaired by: Xue Song, President of CASPA
    Guests:
    Zhang Xiaodong, Vice President of CASPA
    Yin Yiyan, President of Shanghai Association of CASPA and Consultant of SEMI China, serving as CEO of Shanghai Zhanze Information Technology Co., Ltd. at present
    Shan Jianming, Sales Director in China Region of electronic business department of Japan Toppan Group
    Hua Qiwei, Consultant and Past President of CASPA
    Lyu Hao, Xia Haitao, Shi Songhua, Zhou Maolin, Xu Hongtao, and etc..
  • Time: November 29 (Friday) 9:00-12:10
    Place: Hall D on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: SEMI and CBSIA
    Chaired by: Dr. LingZhi Lv, Chairman of the Board & CEO of FA Software
    Time Speech Title
    09:00-9:05 Speech by guests
    Zhang Xin, Senior Vice President of Semiconductor Manufacturing International Corporation
    09:05-09:10 Speech by guests
    Ju Long, Global Vice President and President of China Region from SEMI
    09:10-09:40 Excellent manufacturing of integrated circuits
    Han Di, Senior Chief Inspector of Semiconductor Manufacturing International (Beijing) Corporation
    09:40-10:10 To be a dream chaser for pushing forward the industry of domestic semiconductor equipment
    Ding Peijun, President of NAURA Technology Group Co., Ltd.
    10:10-10:40 Packaging solution of intelligent manufacturing
    Li Weijun (Jeff Lee), R & D Center Manager of ASE
    10:40-11:10 Application of robot in semiconductor display manufacturing industry
    Zhang Mi, Chief Executive Officer of Beijing Sineva Technology Co., Ltd
    11:10-11:40 Precise bonding make the core connected with the core
    Zhu Jinquan, Vice General Manager of Beijing U-PRECISION TECH CO., LTD.
    11:40-12:10 Exploring the power of digital twin through new intelligent manufacturing DNA innovation
    Xu Guangming, CTO of FA Software
  • Time: November 29 (Friday) 13:30-17:30
    Place: Hall B on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: ISSI, BASiC, ALLIN CAPITAL, PHOENIX TREE CAPITAL PARTNERS and CBSIA
    Chaired by: Zhuo Hongjun, Secretary-general of CBSIA
    Time Speech Title
    13:30-13:55 The layout of ISSI in automotive application simulation power semiconductor and the prospect of cooperation with upstream industry chain
    Su Yujian, Marketing Director of simulation product line of ISSI
    13:55-14:20 Silicon carbide power device technology and application
    He Weiwei, CEO of BASiC
    14:20-14:45 All-round battery management path to the future
    Ruan Chenjie, Founder and CEO of Southchip Semiconductor Technology Co., Ltd.
    14:45-15:10 Venture and investment practice of analog chip in China
    Su Renhong, Partner of ALLIN CAPITAL
    15:10-15:35 Opportunities and challenges of localization of power devices
    Huai Yongjin, General Manager of YDME
    15:35-16:00 Market opportunity and application of GaN in power field
    Wu Jia, Xinhe Electronics Co., Ltd.
    16:00-16:25 Application of silicon carbide power module in electric vehicle
    Liang Xiaoguang, Project Leader of power module in Japan R & D Center of ZF
    16:25-16:50 Investment opportunities and challenges of analog and power semiconductors
    Wu Yiliang, Senior Investment Director of Summitview Capital
    16:50-17:30 Round-table conference
    Theme: Analog and power semiconductor localization breakthrough
    Chaired by: Zhuo Hongjun, Secretary-general of CBSIA
    Guests:
    ALLIN CAPITAL, Xinhe Electronics, YDME, BASiC, ISSI, Southchip, ZF Japan, Summitview Capital
  • Time: November 29 (Friday) 13:30-17:30
    Place: Hall D on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: China Merchants Securities and CBSIA
    Chaired by: Fu Cheng, Executive Director of TMT Industry Team in Headquarters of China Merchants Securities Investment Bank
    Time Speech Title
    13:30-13:55 Report by guest
    Yan Fan, Chief Analyst of Research and Development Department, China Merchants Securities
    13:55-14:20 Domestic FPGA R&D and Industrialization
    Wang Haili, Founder and CEO of Hercules (Beijing) Science and Technology Co., Ltd.
    14:20-14:45 Copy to China in the wave of scientific and technological innovation
    Wang Lin, Partner of Walden International Investment Group Limited
    14:45-15:10 The development and challenge of domestic film equipment for IC manufacturing
    Lyu Guangquan, General Manager of Shenyang Piotech Co., Ltd.
    15:10-15:35 Trend and investment of power semiconductor
    Bruce Liao, Founder and CEO of Beijing Green Energy InnoCore Electronic Technology Co., Ltd.
    15:35-16:00 Report by guest
    Fu Cheng, Executive Director of TMT Industry Team in Headquarters of China Merchants Securities Investment Bank
    16:00-16:25 AI Meets Storage - DeepSSD® Application and Prospect
    Sun Tang, Chief Architect of Starblaze Technology
    16:25-16:50 Report by guest
    Xu Wen, Chairman of the Board of Zhejiang Saisi Electronic Technology Co., Ltd.
    16:50-17:30 Round-table conference
    Chaired by: Fu Cheng
    Theme: Opportunities and challenges for financing and listing of semiconductor enterprises in the era of SSE Star Market
    Gao Shen, Management Partner of Phoenix Tree Capital Partners
    Sun Jiaxing, Executive Director of Guoxin Venture Capital
    Wang Bingquan, TMT Managing Director of China Merchants Securities
    Wan Lixi, Chairman of the Board of Zhongke Sealing Testing
    Cheng Jianxun, Chairman Secretary of Chipone
    Huang Xin, Vice General Manager of OnMicro Corporation
  • Time: November 29 (Friday) 9:00-11:50
    Place: Conference Room A on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: ZIA
    Chaired by: Wang Shumin, CEO of Anji Microelectronics Technology (Shanghai) Co., Ltd.
    Time Speech Title
    09:00-9:10 Opening speech
    Kang Jin, Principal of North Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd.
    09:10-09:30 Synthesis of nanometre powder in microreactor
    Professor Wang Yujun, Deputy Director of Department of Chemical Engineering, Tsinghua University
    09:30-09:50 Development and solution of etching residue removal technology
    Peng Hongxiu, Product Director of Anji Microelectronics Technology (Shanghai) Co., Ltd.
    09:50-10:10 “Target” of “core” holds the future
    Luo Junfeng, R & D Supervisor of Beijing GRIKIN Advanced Material Co., Ltd
    10:10-10:30 Thoughts on the development of fluorinated electronic chemical materials industry for IC manufacturing in China
    Chen Gang, General Manager of GrandiT Co., Ltd.
    10:30-10:50 Challenges and opportunities of semiconductor materials localization
    Mei Lili, Senior Vice President of Hubei Dinglong Chemical Co., Ltd
    10:50-11:10 The present situation, opportunities and challenges of semiconductor quartz market
    Zhang Zhongshu, Chairman of the Board of Beijing Kaide Quartz Co., Ltd.
    11:10-11:30 Present situation and prospect of wet electronic chemicals
    Li Xia, Marketing Director of Suzhou Crystal Clear Chemical Co., Ltd.
    11:30-11:50 Nanoscale filtration solution for wet chemicals
    Luo Shizhou, Technical Consultant and Expert of Hangzhou Cobetter Filtration Equipment Co., Ltd.
  • Time: November 29 (Friday) 9:00-11:50
    Place: Conference Room E on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: ZIA
    Chaired by: Lei Zhenlin, Chairman of the Board of SKY Technology Development Co., Ltd, CAS
    Time Speech Title
    09:00-9:10 Opening speech
    Kang Jin, Principal of North Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd.
    09:10-09:30 Application and future planning of domestic IC parts
    Zhao Jian, Senior Technical Expert of North Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd.
    09:30-09:50 Development trend of IC vacuum pump technology
    Wang Guangyu, Vice General Manager of SKY Technology Development Co., Ltd, CAS
    09:50-10:10 Precision technology leads the future
    Li Xin, Sales Director of Beijing U-PRECISION TECH CO., LTD.
    10:10-10:30 Independent and controllable research on the localization of high-end IC consumables
    Zhang Hui, General Manager of the Board of Beijing Eprosemi Co., Ltd.
    10:30-10:50 Development trend of RF power supply in semiconductor equipment
    Li Guangjian, Vice General Manager / Senior Expert of Beijing BBEF Science & Technology Co., Ltd.
    10:50-11:10 General vacuum solutions and semiconductor industry layout
    Zheng Hong, General Manager in China Region of Pfeiffer Vacuum (Shanghai) Co., Ltd.
    11:10-11:30 The localization of key components of semiconductor gas system
    Fan Zhimin, Chief Supervisor of Marketing Department of Kunshan Kinglai Hygienic Application Materials Co., Ltd.
    11:30-11:50 Development and opportunity of advanced ceramic parts
    Tao Jinweng, Assistant to General Manager of Shanghai Companion Precision Ceramic Co., Ltd
    11:50-13:30 Lunch
    14:30-17:00 Matchmaking meeting of localized components platform
    Place: NAURA Technology Group Co., Ltd.
  • Time: November 29 (Friday) 13:30-17:00
    Place: Conference Room C on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: ZIA
    Chaired by: Zhang Guoming, Vice President of NAURA Technology Group Co., Ltd.
    Time Speech Title
    13:30-13:40 Opening speech
    Zhang Xin, Senior Vice President of Semiconductor Manufacturing International Corporation
    13:40-14:05 NAURA helps boost the innovation and development of 8-inch characteristic process market
    Liu Shaohua, Chief Scientist of NAURA Technology Group Co., Ltd.
    14:05-14:30 Development and New Opportunities of Integrated Circuit Equipment
    Liang Qiang, General Manager in China Region of Beijing E-town Semiconductor Technology Co., Ltd.
    14:30-14:55 Development and product application of TSS series EFEM
    Tan Xueke, Chief Engineer of Semiconductor Equipment BG, Shenyang SIASUN Robot & Automation CO., Ltd
    14:55-15:20 Localization of atomic layer deposition technology in the manufacture of new logic and memory devices
    Li Weiming, CTO and Co-founder of Jiangsu Leadmicro Nano-Equipment Technology Ltd
    15:20-15:45 The development and challenge of domestic film equipment for IC manufacturing
    Wu Biao, Vice General Manager of Shenyang Piotech Co., Ltd.
    15:45-16:10 Current situation, challenges and opportunities of domestic semiconductor IC measuring and testing equipment
    Liu Shiyuan, Chief Scientist of Shanghai Precision Measurement Semiconductor Technology, Inc.
    16:10-16:35 Challenges and solutions in the development of advanced plasma etcher
    Liu Zhiqiang, Senior Director of ICP Plasma Etching Product Department of Advanced Micro-Fabrication Equipment Inc. China
    16:35-17:00 System intelligence optimizes machine learning
    Yuan Zhihong, Exclusive Expert of Department of Chemical Engineering, Tsinghua University
  • Time: November 29 (Friday) 13:30-17:30
    Place: Conference Room A on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: ZIA
    Chaired by: Li Xinguo, Chief Inspector of Semiconductor Manufacturing International (Beijing) Corporation
    Time Speech Title
    13:30-13:40 Speech by guests
    Xu Bin, Director-general of Beijing Green Manufacturing Industry Alliance and Secretary-general of BHEA
    Jiang Lei, Senior Chief Inspector of Semiconductor Manufacturing International (Beijing) Corporation
    13:40-14:05 Construction of dust-free room and energy-saving operation management
    Liu Hao, Senior Manager of Semiconductor Manufacturing International (Beijing) Corporation
    14:05-14:30 Construction and evaluation of green intelligent chip factory
    Chao Yang, Chief Architect and Senior Engineer at Professor Level of China Electronics Engineering Design Institute Co., Ltd.
    14:30-14:55 High precision temperature control technology exchange of IC workshop
    Hua Laizhen, Deputy Director of Research Institute, China Electronics System Engineering No. 2 Construction Co., Ltd.
    Dong Liandong, Assistant to the Director of Research Institute, China Electronics System Engineering No. 2 Construction Co., Ltd.
    14:55-15:20 Solution of new structure and material in electronic industry and application of intelligent manufacturing
    Chen Yingchun, Chief Engineer of The Fourth Construction Co., Ltd. of China Electronics System Engineering
    15:20-15:45 Development of HPC-9N gas purifier and its application in 12"chip production line
    Gao Song, Manager of Environmental Protection Business Department of Dalian High Purity Chemical Co., Ltd.
    15:45-16:10 Discussion on boron ion removal technology in ultra-pure water system
    Zhang Jianqing, Vice General Manager of TG Hilyte Environmental Technology (Beijing) Co., Ltd.
    16:10-16:35 Key technologies of intensive treatment and resource utilization of waste water and liquid from integrated circuit industry
    Luo Jiahao, Director of Waste Water Treatment and Resource Research Office of China Electronics System Engineering No. 2 Construction Co., Ltd. and China Electronics Innovation Environmental Technology Co., Ltd.
    16:35-17:00 Discussion on process emission reduction technology of Pan-semiconductor industry
    Liu Xiaoqing, Technical Manager of Shanghai Shengjian Environment System Technology Co., Ltd.
    17:00-17:25 Ultra-low concentration emission technology of volatile organic gas
    Fu Yamin, Technical Chief Inspector of Shanghai Huamao Environmental Protection Energy Saving Equipment Co., Ltd.
    17:25-17:30 Taking a group photo to mark the occasion
  • Time: November 29 (Friday) 09:00-12:00
    Place: Conference Room C on the second floor of Pavilion C of Etrong International Exhibition & Convention Center in Beijing Economic-Technological Development Area
    Undertaking Party: Beijing Green Manufacturing Industry Alliance
    Chaired by: Xu Bin, Director-general of Beijing Green Manufacturing Industry Alliance and Secretary-general of BHEA
    Time Speech Title
    8:30-9:00 Signing in
    9:00-9:20 Speech by leaders:
    1. Speech by leaders at the level of ministry and commission
    2. Speech by leaders of Beijing Municipality
    3. Speech by leaders of the development area
    9:20-9:40 Construction and evaluation of green supply chain
    Lu Chunyang, Director of CTTL-Terminals, China Academy of Information and Communications Technology
    9:40-10:00 The best application scenario of green blockchain technology - industry green supply chain traceability
    Zong Fang, Director of Promotion Center of Chinese Institute of Electronics and Secretary-General of Energy Conservation and Emission Reduction Committee
    10:00-10:20 Green design product and system integration
    Liu Wei, Director of Standards and Environmental Affairs, Lenovo Group
    10:20-10:40 Extended production link of green supply chain
    Wang Yuhua, Chief Engineer and Director of Laboratory of Guangfeng Jinyuan (Beijing) Technology Co., Ltd.
    10:40-11:20 Round-table conference
    Theme: Headquarters Economy and Green Park Development
    Chaired by: Jiang Lei, Deputy Director-general of Beijing Green Manufacturing Industry Alliance
    Senior Chief Inspector of Semiconductor Manufacturing International (Beijing) Corporation
    Guests:
    Liu Wei, Director of Standards and Environmental Affairs, Lenovo Group
    Ma Jiangjun, Director of Environmental Management Department of BOE Technology Group Co., Ltd.
    Yang Yutao, Technical Director of CESI Certification Co., Ltd.
    Sun Peng, Director & Vice President of Guangfeng Jinyuan (Beijing) Technology Co., Ltd.
    11:20-11:40 Making consensus declaration and taking a group photo to mark the occasion
    11:40 The conference ends

Remark: This is the preliminary agenda, and the final arrangement is subject to the date of issuance

Hotel
Recommended Hotel
Surrounding hotels
Hotel name Telephone Hotel Address Price/Yuan
Chaolin Songyuan Hotel 010-53876999 No.19, Ronghua Middle Road, economic and Technological Development Zone, Daxing District, Beijing Agreement price of the conference
Beijing Fengda International Hotel 010-67518888 No. 20, Ronghua Middle Road, Beijing Economic and Technological Development Zone Agreement price of the conference
Hotel Name Telephone Hotel Address Price
Pullman Beijing Xingji 010-87228888 No.20,Ronghua South Road,Beijing Economic and Technological Development Zone 600-1200
Chaolin Songyuan Hotel 010-53876999 Chaolin Songyuan Hotel, No. 19, Ronghua Middle Road, Beijing Economic and Technological Development Zone 1000 or so
Jinjiang Fuyuan Hotel 010-67800888 No. 11, Ronghua Middle Road, Beijing Economic and Technological Development Zone 520-880
Holiday Inn Express Yizhuang 010-64168281 Building 1, No. 10, Ronghua South Road, Beijing Economic and Technological Development Zone 500 or so
Lieutenant Subaru 010-59767766 No. 16, Ronghua South Road, Beijing Economic and Technological Development Zone 400-450
Boda Wanyuan Hotel 010-67886611 No. 7 Hongda North Road, Beijing Economic and Technological Development Zone 400 or so
All Seasons Hotel (Yizhuang) 010-59767666 Building 11.12, 18 Kangding Street, Beijing Economic and Technological Development Zone 350-400
Beijing Boda Yongkang Business Hotel 010-87855585 No. 18, Kangding Street, Economic and Technological Development Zone, Daxing District, Beijing 300-400
Hanting Hotel (Yizhuang Branch) 010-87163939 51-1, No. 2, Jingyuan North Street, Economic and Technological Development Zone,Daxing District, Beijing, 300-350
GreenTree Inn (Beijing Kechuang Second Street) 010-56842998 Kechuang 5th Street, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing, opposite Xinghai Piano Factory 200 or so
Home fast 010-59767666 1-3F, Zhonglu Subaru Building, 16 Ronghua South Road, Daxing District, Beijing 250-300
7 Days Inn (Beijing Yizhuang Branch) 010-67873677 No. 5, Tianhua North Street, Daxing District, Beijing 220-250
Jinjiang Inn (Beijing Yizhuang) 010-67856363 Block 25-1, No. 2, Jingyuan North Street, Economic Development Zone, Daxing District, Beijing 220-250
Hanting Hi Inn (Beijing Yizhuang Yongchang South Road) 010-67856555 Block D, 2 Xingye Street, Economic and Technological Development Zone, Daxing District, Beijing 200-250

Beijing Internation Seminar on Micro-Electronics & IC WORLD Conference

京ICP备19033821号   Copyright 2019 © 2019 IC World congress and Exposition